The cost of designing and developing a complex integrated circuit is quite high, normally in the multiple tens of millions of dollars. Modern semiconductor chips have billions of components, and are too complex to be designed by hand. Software tools to help the designer are essential. The tools work together in a design flow that engineers use to design and analyze entire semiconductor chips. Integrated circuits can be classified into analog ,  digital  and mixed signal ,  consisting of both analog and digital signaling on the same IC.
Digital integrated circuits can contain anywhere from one  to billions  of logic gates , flip-flops , multiplexers , and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration.
These digital ICs, typically microprocessors , DSPs , and microcontrollers , work using boolean algebra to process "one" and "zero" signals.
Among the most advanced integrated circuits are the microprocessors or " cores ", which control everything from personal computers and cellular phones to digital microwave ovens. Digital memory chips and application-specific integrated circuits ASICs are examples of other families of integrated circuits that are important to the modern information society. In the s, programmable logic devices were developed.
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These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a single chip to be programmed to implement different LSI-type functions such as logic gates , adders and registers. Programmability comes in at least four forms - devices that can be programmed only once , devices that can be erased and then re-programmed using UV light , devices that can be re programmed using flash memory , and field-programmable gate arrays FPGAs which can be programmed at any time, including during operation.
Analog ICs, such as sensors , power management circuits , and operational amplifiers op-amps , work by processing continuous signals. They perform analog functions such as amplification , active filtering , demodulation , and mixing. ICs can also combine analog and digital circuits on a single chip to create functions such as analog-to-digital converters and digital-to-analog converters. Such mixed-signal circuits offer smaller size and lower cost, but must carefully account for signal interference.
Prior to the late s, radios could not be fabricated in the same low-cost CMOS processes as microprocessors. Modern electronic component distributors often further sub-categorize the huge variety of integrated circuits now available:. The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid-state vacuum tube.
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Starting with copper oxide , proceeding to germanium , then silicon , the materials were systematically studied in the s and s. Today, monocrystalline silicon is the main substrate used for ICs although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs , lasers , solar cells and the highest-speed integrated circuits.
It took decades to perfect methods of creating crystals with minimal defects in semiconducting materials' crystal structure. The main process steps are supplemented by doping and cleaning. Mono-crystal silicon wafers are used in most applications or for special applications, other semiconductors such as gallium arsenide are used.
The wafer need not be entirely silicon. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal typically aluminium or copper tracks deposited on them. Dopants are impurities intentionally introduced to a semiconductor to modulate its electronic properties. Doping is the process of adding dopants to a semiconductor material. Since a CMOS device only draws current on the transition between logic states , CMOS devices consume much less current than bipolar junction transistor devices. A random-access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even a microprocessor will have memory on the chip.
See the regular array structure at the bottom of the first image. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to "expose" a layer of material, as they would be too large for the features.
Thus photons of higher frequencies typically ultraviolet are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. Each device is tested before packaging using automated test equipment ATE , in a process known as wafer testing , or wafer probing.
The wafer is then cut into rectangular blocks, each of which is called a die. Each good die plural dice , dies , or die is then connected into a package using aluminium or gold bond wires which are thermosonically bonded  to pads , usually found around the edge of the die. Thermosonic bonding was first introduced by A. Coucoulas which provided a reliable means of forming these vital electrical connections to the outside world.
After packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Industrial CT scanning can also be used. This is known as Rock's law. Today, the most advanced processes employ the following techniques:. The earliest integrated circuits were packaged in ceramic flat packs , which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package DIP , first in ceramic and later in plastic.
This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0. In the late s, plastic quad flat pack PQFP and thin small-outline package TSOP packages became the most common for high pin count devices, though PGA packages are still used for high-end microprocessors. Ball grid array BGA packages have existed since the s.
Flip-chip Ball Grid Array packages, which allow for much higher pin count than other package types, were developed in the s. In an FCBGA package the die is mounted upside-down flipped and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. BGA devices have the advantage of not needing a dedicated socket, but are much harder to replace in case of device failure.
Electrical signals leaving the die must pass through the material electrically connecting the die to the package, through the conductive traces paths in the package, through the leads connecting the package to the conductive traces on the printed circuit board. The materials and structures used in the path these electrical signals must travel have very different electrical properties, compared to those that travel to different parts of the same die.
As a result, they require special design techniques to ensure the signals are not corrupted, and much more electric power than signals confined to the die itself. When multiple dies are put in one package, the result is a system in package , abbreviated SiP. A multi-chip module MCM , is created by combining multiple dies on a small substrate often made of ceramic. The distinction between a large MCM and a small printed circuit board is sometimes fuzzy.riogistreelburt.tk
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Packaged integrated circuits are usually large enough to include identifying information. Four common sections are the manufacturer's name or logo, the part number, a part production batch number and serial number , and a four-digit date-code to identify when the chip was manufactured. Extremely small surface-mount technology parts often bear only a number used in a manufacturer's lookup table to find the integrated circuit's characteristics.
The manufacturing date is commonly represented as a two-digit year followed by a two-digit week code, such that a part bearing the code was manufactured in week 41 of , or approximately in October The possibility of copying by photographing each layer of an integrated circuit and preparing photomasks for its production on the basis of the photographs obtained is a reason for the introduction of legislation for the protection of layout-designs.
The Semiconductor Chip Protection Act of established intellectual property protection for photomasks used to produce integrated circuits. A diplomatic conference was held at Washington, D.
See British Leyland Motor Corp. Armstrong Patents Co. Criticisms of inadequacy of the UK copyright approach as perceived by the US chip industry are summarized in Further chip rights developments. Australia passed the Circuit Layouts Act of as a sui generis form of chip protection. Future developments seem to follow the multi-core multi-microprocessor paradigm, already used by Intel and AMD multi-core processors.
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Intel, as recently as February—August , unveiled a prototype, "not for commercial sale" chip that bears 80 cores. Each core is capable of handling its own task independently of the others. This is in response to heat-versus-speed limit, that is about to be reached [ when? This design provides a new challenge to chip programming. Parallel programming languages such as the open-source X10 programming language are designed to assist with this task. In the early days of simple integrated circuits, the technology's large scale limited each chip to only a few transistors, and the low degree of integration meant the design process was relatively simple.
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Manufacturing yields were also quite low by today's standards. As the technology progressed, millions, then billions  of transistors could be placed on one chip, and good designs required thorough planning, giving rise to the field of electronic design automation , or EDA.
The first integrated circuits contained only a few transistors.
Early digital circuits containing tens of transistors provided a few logic gates, and early linear ICs such as the Plessey SL or the Philips TAA had as few as two transistors. The number of transistors in an integrated circuit has increased dramatically since then. The early integrated circuits were SSI. SSI circuits were crucial to early aerospace projects, and aerospace projects helped inspire development of the technology.
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